TE Connectivity AMP Connectors Diplomate DL SIP socket, 25 (1 x 25) positions, 0.100" (2.54 mm) pitch, through-hole solder termination, tin-plated beryllium copper contacts, closed frame housing, UL94 V-0, -55°C to 105°C.
| Parameter | Value |
|---|---|
| Type | SIP |
| Series | Diplomate DL |
| Mounting | Through Hole |
| Operating temperature | -55°C ~ 105°C |
| Housing material | Thermoplastic, Glass Filled |
| Contact material - post | Beryllium Copper |
| Contact material - mating | Beryllium Copper |
| Material flammability rating | UL94 V-0 |
| Package | Tray |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - post | 0.100\" (2.54mm) |
| Pitch | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Tin |
| Termination post length | 0.130\" (3.30mm) |
| Number of positions or pins | 25 (1 x 25) |
The 643657-1: No official replacement or successor part number is recorded; any pin-compatible alternative would need to match the 25-position, 0.100" pitch SIP footprint and through-hole termination. Available through independent surplus channels — quantities are lot-specific and confirmed at RFQ. No stock-holding claim; sourced per RFQ against the BOM quantity.
Critical for lifecycle planning and risk of supply disruption.
Essential for design-in continuity when original part is end-of-life.
Drives purchasing decisions and budget allocation.
Directly affects procurement lead time and production schedule.
Critical for fit validation in PCB layout.
Needed for environmental compatibility in the application.