Backplane header for high-speed differential-pair routing
The TE Connectivity 6469076-1 is a 60-position header from the Z-PACK HM-Zd series, designed as the backplane-side half of a high-speed differential-pair interconnect system. It carries 40 signal contacts and 20 ground blades in a 4-row by 10-column layout at a 0.098" (2.50mm) pitch — tighter than the standard 0.100" backplane pitch, which means the board footprint is more compact and the routing density higher. The ground blades are interspersed between signal columns to provide a controlled-impedance return path, critical for maintaining signal integrity at multi-gigabit data rates. Termination is press-fit, which eliminates solder joints and allows the header to be pressed into plated through-holes on the backplane without reflow.
The 0.700A per-contact current rating is signal-level — this connector is not sized for power delivery. Each signal contact carries logic-level current, and the ground blades handle the return. The 250V voltage rating provides adequate creepage for backplane environments where the board is inside an enclosure. The 4-row, 10-column arrangement with a 40-signal, 20-ground contact layout means the connector is pre-configured for differential-pair routing — each signal pair has an adjacent ground blade. If your backplane design uses differential pairs, this layout saves you from having to add extra ground vias. The press-fit tail length must match the backplane thickness; verify the board stack-up against the product drawing before committing the footprint.