TE Connectivity Micro MATE-N-LOK header, order code 794637-8, 8 positions, dual row, 3.00 mm pitch, 250 V, gold-plated mating contacts, surface-mount, solder termination, shrouded with locking ramp.
| Parameter | Value |
|---|---|
| Series | Micro MATE-N-LOK |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 250V |
| Current rating | Varies by Wire Gauge |
| Operating temperature | -40°C ~ 105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.364\" (9.25mm) |
| Insulation material | Polyamide (PA), Nylon |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Bulk |
| Features | Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | General Purpose |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 8 |
| Row spacing - mating | 0.118\" (3.00mm) |
| Contact finish - post | Tin-Lead |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 794637-8: Solder retention features hold the part during reflow.
Within the Micro MATE-N-LOK 3.00 mm-pitch family, the 8-position 794637-8 is one of several dual-row options sharing the same pitch, row spacing, and shrouded locking-ramp design.