Press-fit pin socket for legacy and high-reliability boards
The 8134-HC-12P3 is a HOLTITE series press-fit pin socket from TE Connectivity AMP Connectors, designed to accept round pins from 0.035" to 0.045" diameter. The beryllium copper contact is plated with 80.0µin of tin-lead, a thick finish that handles repeated insertion and withdrawal without galling — useful in test points, programming headers, or modular board interconnects where the socket sees more than a few mating cycles. Termination is press-fit into a 0.082" mounting hole on a board thickness of 0.050" — no solder, no tail to trim. The 0.156" overall length keeps the socket low-profile above the board surface, which matters when the mating pin has limited z-height clearance.
Board prep and fit check
The recommended mounting hole diameter is 0.082" (2.08mm), and the socket accepts a pin hole diameter of 0.052" (1.32mm). For a reliable press-fit, the board thickness should be 0.050" (1.27mm) — the socket's retention features are designed for that stack-up. If your board is thicker or thinner, the press-fit interference changes and may affect retention force. The contact material is beryllium copper, which provides good spring properties and fatigue life over repeated pin insertions. The tin-lead finish (80.0µin thick) offers a low-friction surface that resists fretting corrosion in moderate environments, though it is not rated for lead-free soldering processes due to the lead content.