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TE Connectivity AMP Connectors 816-AG11D-ESL-LF — Pin Headers, Sockets & Housings

816-AG11D-ESL-LF TE Connectivity 16-Pin DIP Socket –

MPN816-AG11D-ESL-LF
Obsolete

TE Connectivity AMP Connectors 800 series, 816-AG11D-ESL-LF, 16 (2 x 8) position DIP socket, 0.100" (2.54 mm) pitch, 0.300" (7.62 mm) row spacing, open frame, through-hole solder termination, gold flash mating contacts, PCT housing, UL94 V-0.

$2.6100Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Jul 2026

Specifications

816-AG11D-ESL-LF key specifications
ParameterValue
TypeDIP, 0.3\" (7.62mm) Row Spacing
Series800
MountingThrough Hole
Operating temperature-55°C ~ 105°C
Housing materialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact material - postCopper
Contact material - matingBeryllium Copper
Material flammability ratingUL94 V-0
PackageTube
FeaturesOpen Frame
TerminationSolder
Pitch - post0.100\" (2.54mm)

All specifications

816-AG11D-ESL-LF additional specifications
ParameterValue
Pitch0.100\" (2.54mm)
Contact resistance10mOhm
Contact finish - postGold
Contact finish - matingGold
Termination post length0.125\" (3.18mm)
Contact finish thickness - postFlash
Contact finish thickness - matingFlash
Number of positions or pins16 (2 x 8)

Product details

Why This 16-Pin DIP Socket Is Worth the Hunt

The 816-AG11D-ESL-LF: The gold flash on both the mating contact and the post provides a corrosion barrier for low-cycle signal applications — think test fixtures, programming headers, or legacy board repairs where the socket sees fewer than 50 insertion cycles over its life. For higher-durability requirements, a thicker gold plating (15 µinch or more) would be the better call.

No official successor part number is published, which means any replacement must be evaluated on form, fit, and function — pitch, position count, row spacing, and mounting style are the non-negotiable dimensions.

Footprint and Mating Half — What to Match

Contact resistance is rated at 10 mOhm, typical for a gold-flash interface in a clean environment. The beryllium copper mating contact provides good spring properties for consistent normal force over the socket's service life.

Temperature and Process Compatibility

The PCT housing material is rated for higher continuous use than standard polyester, making it suitable for applications where the socket sees elevated ambient temperatures near the board. Termination is solder — through-hole only, no press-fit option. The gold flash on the post is compatible with both leaded and lead-free solder processes, though the flash thickness means the post is not intended for repeated rework cycles.

Frequently asked questions

What is the pinout and footprint of the 816-AG11D-ESL-LF?

The socket is a 16-pin DIP layout: two rows of 8 pins each, spaced 0.100" (2.54 mm) apart within a row, with 0.300" (7.62 mm) between rows. The solder tails are 0.125" (3.18 mm) long. The PCB footprint is a 2 x 8 grid of through-holes on 0.100" pitch with 0.300" row spacing.