TE Connectivity AMP Connectors 824-AG31D-ES, Series 800 DIP socket, 24 (2 x 12) positions, 0.100" (2.54 mm) pitch, 0.3" (7.62 mm) row spacing, open frame, through-hole solder termination, tin-lead contacts, 3 A, -55°C to 105°C, UL94 V-0.
| Parameter | Value |
|---|---|
| Type | DIP, 0.3\" (7.62mm) Row Spacing |
| Series | 800 |
| Mounting type | Through Hole |
| Current rating | 3 A |
| Operating temperature | -55°C ~ 105°C |
| Housing material | Polyester |
| Contact material - post | Copper Alloy |
| Contact material - mating | Copper Alloy |
| Material flammability rating | UL94 V-0 |
| Package | Tube |
| Features | Open Frame |
| Termination | Solder |
| Pitch - post | 0.100\" (2.54mm) |
| Pitch | 0.100\" (2.54mm) |
| Contact resistance | 10mOhm |
| Contact finish - post | Tin-Lead |
| Contact finish - mating | Tin-Lead |
| Termination post length | 0.125\" (3.18mm) |
| Number of positions or pins | 24 (2 x 12) |
The 824-AG31D-ES: The open-frame construction leaves the board visible between the contact rows, which helps with trace routing and allows airflow under the socket for thermal management.
No official pin-compatible successor has been published by TE. For a BOM line that depends on this exact footprint and row spacing, the sourcing path is via surplus or aftermarket inventory — quoted to order against the required quantity.
Yes, TE Connectivity has discontinued the 824-AG31D-ES. No official replacement part number has been issued.
This matches the standard 24-pin DIP IC footprint.