0.100-inch pitch, 14-position unshrouded header
The 825440-7: This is a TE Connectivity AMPMODU Mod II unshrouded header, 14 positions arranged in two rows at 0.100-inch (2.54 mm) pitch. The tin-plated solder tails (98.4 µinch) wet well in wave solder.
Dual-row layout and overall dimensions
The header stands 0.500 inches (12.70 mm) overall from the board surface: 0.264 inches (6.70 mm) of mating pin length, 0.110 inches (2.79 mm) of insulator height, and 0.126 inches (3.20 mm) of solder tail. Row spacing is also 0.100 inches (2.54 mm), so the footprint is a standard 2×7 grid.
