TE Connectivity AMPMODU Mod II unshrouded breakaway header, 10 positions, dual-row, 0.100" (2.54mm) pitch, through-hole solder termination, gold-plated mating contacts, rated 5A, UL94 V-0 green PBT housing.
| Parameter | Value |
|---|---|
| Series | AMPMODU Mod II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 5A |
| Operating temperature | -65°C~105°C |
| Contact material | Brass |
| Insulation color | Green |
| Insulation height | 0.110\" (2.79mm) |
| Insulation material | Polybutylene Terephthalate (PBT) |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 10 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.126\" (3.20mm) |
| Overall contact length | 0.465\" (11.81mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.228\" (5.80mm) |
| Contact finish thickness - post | 118.1µin (3.00µm) |
| Contact finish thickness - mating | 3.90µin (0.099µm) |
The 826656-5: The unshrouded design means there's no polarizing wall around the pins — it mates with standard 0.100" receptacles but offers less mechanical keying than a shrouded header.
For continuous operation near the upper temperature bound, derate the current per the product drawing.
The 0.110" (2.79mm) insulation height keeps the header low-profile above the board.
Buyers need to verify compatibility with mating connectors before design-in.
Determines if board-to-board stacking height or cable connection is possible without side protection.
Sourcing buyers need to quickly find authorized distributors to complete BOM.
Critical for cost estimation and volume pricing negotiation.
Ensures correct receptacle selection for reliable interconnection.
Lifecycle status affects long-term availability and risk of redesign if EOL.