Obsolete — Sourcing Reality for 832-AG11D-ESL-LF
Available through independent distribution channels.
32-Position Dual-Row Layout and 0.100" Pitch
The 0.600" (15.24 mm) row spacing is a common DIP pattern, compatible with many production sockets and test fixtures.
Gold flash on the mating contacts — this is a thin gold layer over the base copper alloy. It provides corrosion resistance for occasional mating but does not support the high cycle life of thicker gold plating. Rated 3 A per contact, typical for signal-level circuits in this pitch class. The post side uses tin-lead solder tails, compatible with standard through-hole soldering processes.
