Termination and Mating Fit
The mating interface accepts a standard 0.100" pitch IDC socket or crimp receptacle; the 0.6" row spacing is a common footprint for DIP-style headers used in legacy board layouts.

TE Connectivity AMP Connectors 840-AG11D, Series 800, 40-pin (2 x 20) DIP header, 0.100" (2.54mm) pitch, 0.6" (15.24mm) row spacing, through-hole solder termination, open-frame, gold mating contacts rated 3 A, UL94 V-0 polyester housing.
| Parameter | Value |
|---|---|
| Type | DIP, 0.6\" (15.24mm) Row Spacing |
| Series | 800 |
| Mounting | Through Hole |
| Current rating | 3 A |
| Operating temperature | -55°C~105°C |
| Housing material | Polyester |
| Contact material - post | Copper Alloy |
| Contact material - mating | Copper Alloy |
| Material flammability rating | UL94 V-0 |
| Package | Tube |
| Features | Open Frame |
| Termination | Solder |
| Parameter | Value |
|---|---|
| Pitch - post | 0.100\" (2.54mm) |
| Pitch | 0.100\" (2.54mm) |
| Contact resistance | 10mOhm |
| Contact finish - post | Tin-Lead |
| Contact finish - mating | Gold |
| Termination post length | 0.125\" (3.18mm) |
| Contact finish thickness - mating | 25.0µin (0.63µm) |
| Number of positions or pins | 40 (2 x 20) |
The mating interface accepts a standard 0.100" pitch IDC socket or crimp receptacle; the 0.6" row spacing is a common footprint for DIP-style headers used in legacy board layouts.
No official replacement or second-source is recorded. Available through independent surplus channels; availability is confirmed per RFQ.
The 840-AG11D is a 40-pin DIP header arranged as 2 rows of 20 positions, with 0.100" (2.54mm) pitch between pins and 0.6" (15.24mm) row spacing. The open-frame design exposes the through-hole solder tails for inspection.
The gold mating finish (25.0µin) supports low and stable contact resistance over repeated mating cycles.