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TE Connectivity AMP Connectors 840-AG11D-ESL-LF — Pin Headers, Sockets & Housings

840-AG11D-ESL-LF TE Connectivity 40-Pin DIP Header

MPN840-AG11D-ESL-LF
Active

TE Connectivity AMP Connectors Series 800, 840-AG11D-ESL-LF, 40 (2 x 20) position DIP header, 0.100" (2.54 mm) pitch, 0.6" (15.24 mm) row spacing, through-hole solder termination, gold flash mating and post contacts, open-frame PCT housing, UL94 V-0.

$5.4800Ref. price · indicative, final on quote
TE Connectivity AMP Connectors 840-AG11D-ESL-LF datasheet (PDF)
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

840-AG11D-ESL-LF key specifications
ParameterValue
TypeDIP, 0.6\" (15.24mm) Row Spacing
Series800
MountingThrough Hole
Operating temperature-55°C~105°C
Housing materialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact material - postCopper
Contact material - matingBeryllium Copper
Material flammability ratingUL94 V-0
PackageTube
FeaturesOpen Frame
TerminationSolder
Pitch - post0.100\" (2.54mm)

All specifications

840-AG11D-ESL-LF additional specifications
ParameterValue
Pitch0.100\" (2.54mm)
Contact resistance10mOhm
Contact finish - postGold
Contact finish - matingGold
Termination post length0.125\" (3.18mm)
Contact finish thickness - postFlash
Contact finish thickness - matingFlash
Number of positions or pins40 (2 x 20)

Product details

40-Pin DIP Header for High-Density Board Interconnects

The 840-AG11D-ESL-LF: The open-frame PCT housing (UL94 V-0 rated) exposes the solder tails for visual inspection and rework, while the beryllium copper mating contacts with gold flash finish provide reliable signal-level connections for repeated but not high-cycle mating.

Copper post material with gold flash finish keeps the solder joint corrosion-resistant and compatible with standard lead-free soldering profiles.

Gold Flash Contacts and Contact Resistance

Contact resistance is rated at 10 mOhm, a typical value for a gold-on-gold interface in a dry-circuit signal path — the beryllium copper beam maintains normal force to keep resistance stable over temperature.

Frequently asked questions

What is the row spacing of 840-AG11D-ESL-LF?

The row spacing is 0.6" (15.24 mm), which is the standard DIP dimension for a 40-pin dual-in-line package.