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TE Connectivity AMP Connectors 9-146253-0-09 — Pin Headers, Sockets & Housings

TE 9-146253-0-09 AMPMODU Mod II Header, 18 Pos, 2.54mm

MPN9-146253-0-09
Active

TE Connectivity AMP Connectors AMPMODU Mod II header, breakaway, order code 9-146253-0-09, 18 positions, dual row, 0.100" (2.54 mm) pitch, 3 A, gold-plated mating contacts, through-hole, solder termination.

$2.5300Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

9-146253-0-09 key specifications
ParameterValue
SeriesAMPMODU Mod II
TypeMale Pin
MountingThrough Hole
Connector typeHeader, Breakaway
Fastening typePush-Pull
Current rating3A
Operating temperature-65°C~105°C
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.090\" (2.29mm)
Insulation materialLiquid Crystal Polymer (LCP)
Material flammability ratingUL94 V-0

All specifications

9-146253-0-09 additional specifications
ParameterValue
StyleBoard to Board or Cable
PackageBulk
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions18
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.125\" (3.18mm)
Overall contact length0.533\" (13.55mm)
Contact finish - matingGold
Contact length - mating0.318\" (8.08mm)
Contact finish thickness - post100.0µin (2.54µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Breakaway header, 18 circuits, 3 A

The 9-146253-0-09 is the 18-circuit member of TE's AMPMODU Mod II breakaway header line, a dual-row unshrouded header on 0.100" (2.54 mm) pitch. Rated 3 A per contact with gold-plated mating surfaces (30.0 µin) and tin-plated posts, it suits board-to-board or cable interconnect duty within a -65°C to 105°C operating range.

Pitch, footprint, and board fit

The 0.100" (2.54 mm) row spacing matches the pitch, so the footprint occupies a standard 0.100" x 0.100" grid — a common layout for prototyping and production boards. Unshrouded push-pull fastening and a UL94 V-0 LCP insulator keep the header suitable for open-board environments where the mating half is keyed separately.