TE Connectivity AMPMODU Mod II, Header, Breakaway, 50 Positions, 0.100" (2.54mm) Pitch, 2 Rows, Through Hole, Solder, Unshrouded, Tin Plating, UL94 V-0
| Parameter | Value |
|---|---|
| Series | AMPMODU Mod II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.090\" (2.29mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 50 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.090\" (2.29mm) |
| Overall contact length | 0.410\" (10.41mm) |
| Contact finish - mating | Tin |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
This is a common choice for board-to-board stacking or for cable-to-board connections where the mating half has a shroud.
The housing is black liquid crystal polymer (LCP) rated UL94 V-0, which handles reflow and wave-solder temperatures without distortion.
The pitch is 0.100" (2.54mm) with 50 positions in two rows. The row spacing is also 0.100" (2.54mm), matching standard AMPMODU Mod II receptacles.
Unshrouded. There is no polarisation wall around the pins, so the mating half must provide alignment. This is typical for breakaway headers used in board-to-board or cable-to-board connections.
Availability and current pricing confirmed at quote time.