Footprint and Layout Fit
The 0.100-inch pitch sets the board footprint — a standard grid that matches most IDC sockets and crimp receptacles. The 0.090-inch insulator height leaves clearance for low-profile mating housings.
Peer Comparison: Gold Plating Thickness
The closest functional peer is 1376779-2, also a 3 A, 20-position, unshrouded header with gold mating finish. The difference is plating thickness: 9-146276-0-20 carries 15 µinch gold on the mating contact, while 1376779-2 uses 8 µinch gold. For applications requiring more than 100 mating cycles or exposure to mildly corrosive atmospheres, the thicker gold layer on this part provides a measurable margin against contact fretting.