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TE Connectivity AMP Connectors 9-146285-0-18 — Pin Headers, Sockets & Housings

9-146285-0-18 TE AMPMODU Mod II Header, 18 Pos, 2.54mm Pitch

MPN9-146285-0-18
Active

TE Connectivity AMP Connectors AMPMODU Mod II unshrouded header, breakaway, 18 positions, single row, 0.100" (2.54mm) pitch, through-hole solder termination, gold mating contact finish, 3A rating, UL94 V-0 LCP housing, black insulation.

$2.5200Ref. price · indicative, final on quote
TE Connectivity AMP Connectors 9-146285-0-18 datasheet (PDF)
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

9-146285-0-18 key specifications
ParameterValue
SeriesAMPMODU Mod II
TypeMale Pin
MountingThrough Hole
Connector typeHeader, Breakaway
Fastening typePush-Pull
Current rating3A
Operating temperature-65°C~105°C
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.090\" (2.29mm)
Insulation materialLiquid Crystal Polymer (LCP)
Material flammability ratingUL94 V-0

All specifications

9-146285-0-18 additional specifications
ParameterValue
StyleBoard to Board or Cable
PackageBulk
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows1
Pitch0.100\" (2.54mm)
Positions18
Contact finish - postTin
Contact length - post0.090\" (2.29mm)
Overall contact length0.410\" (10.41mm)
Contact finish - matingGold
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - post100.0µin (2.54µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Board Layout Fit: Pitch, Row Count, and Footprint

The 9-146285-0-18: The single row keeps the board-edge width to just over 1.8" (45.7 mm) for the pin field, leaving room for routing traces between the through-hole solder tails. This gives you the lowest profile above the board (insulation height 0.090"/2.29 mm) but offers no polarization against mis-mating, so board layout should ensure the receptacle orientation is fixed.

Current Capacity and Contact Plating

The post (solder tail) is finished with 100 µinch tin — adequate for wave-solder wetting and a reliable solder fillet in the through-hole plated hole.

Mates with any standard AMPMODU Mod II receptacle or IDC socket on 0.100" pitch — look for the same 18-position, single-row footprint. The LCP housing withstands wave-solder temperatures without distortion.

Frequently asked questions

What socket connectors are compatible with 9-146285-0-18?

Any AMPMODU Mod II receptacle or IDC socket on 0.100" pitch with 18 positions and a single row will mate. The unshrouded header has no keying, so the receptacle must be oriented correctly in the assembly.