TE Connectivity AMPMODU Mod II, Header, Breakaway, 32 Positions, 0.100" (2.54mm) Pitch, Dual Row, Through Hole, Right Angle, Unshrouded, Male Pin, Gold Mating, Tin Post, 3A, UL94 V-0, Black Thermoplastic, Active
| Parameter | Value |
|---|---|
| Series | AMPMODU Mod II |
| Type | Male Pin |
| Mounting | Through Hole, Right Angle |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.238\" (6.05mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 32 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.120\" (3.05mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The mating contact surface carries 30.0µinch (0.76µm) gold over copper alloy, with a tin-plated solder post (100.0µinch / 2.54µm). The tin post is standard for solder-joint reliability in wave or hand-solder assembly. For power delivery above 3 A per circuit, a higher-current series or multiple parallel pins would be needed.
The mating pitch is 0.100" (2.54mm), and the row spacing is also 0.100" (2.54mm). This is a standard 0.100" grid footprint.
Common mates include AMPMODU Mod II receptacles with matching circuit count and pitch.
The AMPMODU Mod II series includes other 0.100" pitch headers with different position counts or orientations, but a pin-compatible substitute would require matching the 32-position, dual-row, right-angle, unshrouded form factor.