20-Pin IDC DIP Header for 28 AWG Ribbon Cable
The TE Connectivity Micro-MaTch 9-215570-0 is a 20-position DIP header designed for mass-termination of 0.050" pitch ribbon cable via IDC contacts.
Press-Fit Mount, No Solder
Mounting is Through Hole, Press-Fit — the header presses into plated through-holes without solder. This speeds board assembly and avoids thermal stress on the IDC connections, but the press-fit interference requires the PCB hole size to match the manufacturer's recommended finished hole diameter. The Feed Through feature lets the cable pass beyond the header for daisy-chain or pass-through routing in harness assemblies.
Wire and Cable Compatibility
Accepts 28 AWG stranded or solid wire — no other gauge is supported by the IDC slot geometry. The cable pitch is 0.050" (1.27 mm), standard for 28 AWG rainbow ribbon cable. The dual-row IDC termination mass-terminates all 20 conductors in one press operation with the correct tooling; hand-loading individual wires is not an option.
Active, ROHS3, Sourced to Order
ROHS3 compliant.
20 vs 16 Positions — 1-216791-6
The 16-position sibling 1-216791-6 shares the same Micro-MaTch series, same 0.050" cable pitch, same 0.100" board-side pitch, same press-fit mounting, and same Tin contact finish. The decision is purely position count: 20 circuits for a 20-conductor ribbon, 16 circuits for a 16-conductor ribbon. The 1-216791-6 ships in a Box rather than Tape & Reel, and its contacts carry a 118.1 µin (3.00 µm) Tin plating thickness — the 9-215570-0 contact finish thickness is not listed on its spec, so if plating thickness is a qualification parameter, confirm the 9-215570-0 value from the manufacturer's drawing before substituting.