Board-to-board receptacle with dual-entry flexibility
The receptacle accepts bottom or top entry, meaning you can route the mating header from either side of the board, which helps when the board stack-up has clearance constraints on one face. Surface-mount solder tails keep the assembly reflow-compatible with standard SMT lines.
Gold mating finish for repeated connect cycles
The mating contact surface carries 31.5 µinch (0.80 µm) of gold over nickel — well above a flash coating. The tin tail mates to the board pad during reflow; the gold face handles the separable interface.