Board-to-board fit: 14 positions, 0.100-inch pitch, SMT
The 0.100-inch pitch and 0.100-inch row spacing set the footprint — it mates with standard 0.100-inch square-pin headers. Surface-mount termination means it feeds into a reflow line without through-hole tooling. The housing is black liquid crystal polymer (LCP). Insulation height is 0.244 inches (6.20 mm), which sets the mated stack height above the board surface.
The post finish is tin at 98.4 µinch (2.50 µm), which solders reliably to the board pad.