The TE Connectivity 1408337-1 is a QMA-series RF connector — a snap-on, push-pull variant of the SMA interface designed for higher-density panel layouts where the coupling nut of a standard SMA is impractical. This is a jack (female socket) configuration with a right-angle through-hole PCB mount, making it a board-edge launch for RF signal paths up to 6 GHz. The 50 Ohm impedance and 0.25 dB insertion loss place this connector in the standard low-loss RF interconnect class, suited for telecom infrastructure, test equipment, and antenna feed applications where quick mate/unmate is needed without the torque control of a threaded interface. Gold plating on both the body and the beryllium copper center contact gives this connector corrosion resistance and stable contact resistance across its rated 100 mating cycles — adequate for bench test and field-swap duty but not for high-cycle production test fixtures.
RF performance and construction
The 6 GHz upper frequency limit and 0.25 dB insertion loss define the usable signal bandwidth. For a QMA interface, 6 GHz is the standard ceiling — beyond that, the snap-on retention begins to introduce impedance discontinuities. The PTFE dielectric maintains consistent phase response across the band. Shield termination is solder, not a crimp ferrule, which means the braid of the coaxial cable is soldered directly to the connector body during assembly. This is a permanent termination — field replacement means desoldering, not re-crimping. The snap-on fastening uses a spring-loaded collet that grips the mating plug's knurled body. No torque wrench required, but the retention force is lower than a threaded SMA — the connector can unseat under cable strain if the cable is not strain-relieved separately.
For BOM lines specifying this exact order code, procurement will need to source from surplus, broker, or secondary-market channels. No official cross-reference or pin-compatible equivalent from other brands is documented. Any substitute would require verifying the QMA interface dimensions, board footprint, and RF performance against the specific application.
The center contact is beryllium copper with gold plating — a spring-tempered alloy that maintains contact force through the 100-cycle mating life without taking a set. The brass body with gold finish provides the RF ground path and environmental seal at the interface.