Board-fit for a 3-position signal header
The 1734261-3 is a 3-position, single-row header from TE's High Performance Interconnect (HPI) series, designed for board-to-wire connections where the cable exits parallel to the PCB. Its 0.049" (1.25 mm) pitch and right-angle SMT orientation make it a compact choice for routing low-current signals in tight enclosures. The shrouded 4-wall housing protects the male pins during mating and unmating, reducing the risk of bent contacts in field-service applications.
Current, voltage, and temperature limits
Rated at 1 A per contact and 100 VAC, this header is suited for low-power signal or sensor connections rather than power distribution. Tin plating is adequate for moderate mating cycles (typically 25–50) in dry environments; for higher cycle life, consider a gold-plated alternative in the same series.
The 1734261-3's tighter 1.25 mm pitch saves board space but limits current to 1 A per contact. The 1-2232960-3 uses a locking ramp for vibration resistance and is through-hole mounted, while the 1734261-3 is SMT right-angle with solder retention.