The TE Connectivity 2327671-3 is an 84-position, dual-row female edge-card connector from the Sliver 2.0 series. It's designed for board-to-board mezzanine or riser-card applications where a high-density, right-angle interface is needed — think server backplanes, switch line cards, or GPU risers. The 0.60 mm pitch keeps the footprint compact, but routing traces between those pads demands a controlled-impedance stack-up and a 0.062" (1.57 mm) PCB edge thickness to match the card slot.
Pitch, position count, and the 1.57 mm card thickness rule
The 0.60 mm pitch is tight — you're not running wide traces between pads without a fine-line PCB fab. The 84 positions split across two rows (28 per bay, 14 per row in the dual-readout layout) mean the BOM line is fixed: if your design calls for 84 signals, this is the one. The card thickness is specified at 0.062" (1.57 mm) — that's standard PCB edge thickness, so no special board prep or bevel is required.
That's a robust plating thickness for a connector that sees multiple mating cycles — think test fixtures, development boards, or field-replaceable modules.