Sliver 2.0 Edge Connector for High-Density Backplane Routing
The TE Connectivity Sliver 2.0 2327678-3 is an 84-position female edge-card connector built for dense, high-speed differential-pair routing in backplane and mezzanine applications. The 0.60 mm pitch and dual-row readout pack the signal count into a compact board-edge footprint, while the gold-plated contacts (30.0 µin) handle repeated mating cycles in field-serviceable equipment.
What the 0.60 mm Pitch and 84 Positions Mean for Board Layout
The 0.60 mm pitch is the tightest in the Sliver 2.0 family, which means the board-edge footprint is narrow enough to fit multiple connectors along a single card edge, but it also demands a precise edge-card thickness of 0.062" (1.57 mm) and careful trace routing to maintain signal integrity. The 84 positions are split across two rows with a dual readout (28 positions per bay, 14 per row), so the BOM line must match the circuit count exactly — there is no spare position for a keying or alignment pin.
Board-Level Assembly and Retention
The integrated board guide aligns the connector to the edge-card slot during reflow, and the solder-retention feature holds the part in place before the solder solidifies — no separate hold-down hardware is needed.