Board-to-Board Fit: Pitch, Stack Height, and Contact Density
The 5-104078-5: This is a 50-position, dual-row receptacle from the AMPMODU System 50 series, designed for board-to-board stacking. Mated stacking heights of 11.43 mm and 12.57 mm are specified, giving two z-height options for mezzanine spacing.
The mating interface carries 30.0 µinch (0.76 µm) gold over copper alloy. The solder posts are finished with 150.0 µinch (3.81 µm) tin, which wets well during wave or hand soldering and provides a reliable intermetallic bond to the PCB pad.
Environmental and Compliance Ratings
The 1 A per contact limit aligns with the fine-pitch, high-density design.
