TE Connectivity AMPMODU System 50 receptacle, 24 positions, 0.050" (1.27 mm) pitch, 30 µinch gold mating finish, 1 A per contact, -65°C to 105°C, through-hole solder termination, black thermoplastic UL94 V-0 housing.
| Parameter | Value |
|---|---|
| Series | AMPMODU System 50 |
| Type | Female Socket |
| Mounting | Through Hole |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Voltage rating | 30VAC |
| Current rating | 1A |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.350\" (8.89mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Parameter | Value |
|---|---|
| Mated stacking heights | 11.43mm, 12.57mm |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 24 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.100\" (2.54mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 0.050" (1.27 mm) pitch on the mating interface, combined with a row spacing of 0.100" (2.54 mm), sets the PCB footprint for the matching header. The mated stack heights are 11.43 mm and 12.57 mm, which dictate the z-height budget between parallel boards.
The mating pitch is 0.050" (1.27 mm) with a row spacing of 0.100" (2.54 mm).
Yes, it is ROHS3 compliant.
The mated stack heights are 11.43 mm and 12.57 mm.