20-position, 0.050" pitch SMD receptacle with board lock
The 0.050" (1.27 mm) mating pitch sets the PCB footprint density — at this pitch, trace routing between pads is tight, and a 2.54 mm row spacing gives room for a single via between rows on a standard two-layer board.
Mated stack height and voltage ceiling
The connector supports two mated stacking heights: 11.94 mm and 13.08 mm, depending on the header chosen. This gives the board designer a choice of z-height budget for mezzanine or parallel-board stacks. Rated at 30 VAC, the voltage ceiling is low — this is a signal-density interconnect, not a power path. The PPA material handles the high reflow temperatures of lead-free soldering without warping.