Board-to-board mezzanine fit — 40 positions at 0.050" pitch
The 5-104550-5: The 0.050" (1.27 mm) pitch on the mating interface sets the board footprint — tight enough for dense routing, wide enough that a standard 4-layer board can fan out the inner rows without micro-vias. The connector offers two mated stacking heights: 11.94 mm and 13.08 mm, giving the board stack-up designer a choice of board gap without swapping the connector part number.
The solder tail finish is tin, 150.0 µinch (3.81 µm) thick — this is the standard solderable finish for reflow processes.
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The 5-104550-5 packs 40 positions into the same board-edge length at half the pitch, and the gold mating finish gives it a higher mating-cycle endurance than the tin-finished peer.