TE Connectivity AMP Connectors AMPMODU 50/50 Grid, 5-104652-1 — 10-position dual-row receptacle, 0.050" (1.27 mm) pitch, 30 µinch gold mating finish, SMT termination with board lock, mated stack heights 6.35/8.13/9.91 mm.
| Parameter | Value |
|---|---|
| Series | AMPMODU 50/50 Grid |
| Type | Female Socket |
| Mounting | Surface Mount |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Operating temperature | -65°C~105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.187\" (4.75mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Mated stacking heights | 6.35mm, 8.13mm, 9.91mm |
| Style | Board to Board or Cable |
| Parameter | Value |
|---|---|
| Package | Tube |
| Features | Board Lock |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 10 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 5-104652-1: Three mated stack heights (6.35 mm, 8.13 mm, 9.91 mm) let the same receptacle cover different board-to-board spacings, so one BOM line handles multiple mezzanine heights.
The LCP housing handles the reflow profile without distortion.
30 µinch (0.76 µm) gold over nickel on the mating face.
Three stack heights: 6.35 mm, 8.13 mm, and 9.91 mm. The same receptacle works across different board-to-board spacings.