The 2-1445087-9: The SMD orientation places the header flat on the PCB surface, with the 0.364-inch (9.25 mm) insulation height clearing components on the board. The pick-and-place feature allows automated assembly; the solder retention pads hold the header in position during reflow.
The voltage rating is 250 V, which covers most low-voltage power and signal applications inside equipment. The tin-plated solder posts with 100 µinch thickness provide a reliable solder joint; the gold mating finish on the contact area avoids corrosion at the interface. Contact material is brass, a standard choice for cost-effective current-carrying performance.