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Molex Micro-Fit 3.0 43045 series, 430452002, 20-position dual-row right-angle male header, 0.118" (3.00 mm) pitch, 8 A, 600 V, gold-plated mating contacts, tin solder tails, shrouded 4-wall with locking ramp, through-hole, board lock, UL94 V-0.

Molex Micro-Fit 3.0 43045 430450222, Header, Board to Cable/Wire, 2 Positions, 2 Rows, 0.118" (3.00mm) Pitch, Right Angle, Through Hole, Solder, Gold Mating/Tin Tail, 8 A, 600 V.

Molex Micro-Fit 3.0 43045 series header, 430451011, 10-position dual-row, 3.00mm pitch, right-angle SMT, gold mating contacts (30.0µin), 8A, 600V, 4-wall shrouded, locking ramp, UL94 V-0.

Molex Micro-Fit 3.0 43045 series right-angle header, 22 positions (2×11), 0.118" (3.00 mm) pitch, rated 8 A per circuit at 600 V, gold mating face, tin solder tail, through-hole, board lock, shrouded 4-wall, locking ramp, UL94 V-0.

Molex Micro-Fit 3.0 43045 right-angle male header, 4 positions dual-row, 0.118" (3.00 mm) pitch, 8 A per circuit at 600 V, gold-plated mating contacts (15.0 µin) with tin solder tails (100.0 µin), board lock, 4-wall shroud, locking ramp, through-hole, UL94 V-0 LCP housing, -40°C to 105°C.

Molex Micro-Fit 3.0 43045 series header, 430451225, 12 positions dual-row, 3.00 mm pitch, 8 A per circuit, gold mating / tin post plating, 600 V rated, shrouded 4-wall, through-hole solder with kinked pin, board lock and board guide.

Molex Micro-Fit 3.0 43045 header, 18 positions, dual-row, 3.00 mm pitch, 8 A per circuit at 600 V, through-hole kinked-pin solder termination, gold mating finish, 4-wall shrouded with board guide.

Molex Micro-Fit 3.0 43045 series, 430451802, right-angle through-hole header, 18 positions dual-row, 0.118" (3.00 mm) pitch, 8 A per circuit, 600 V, gold-plated mating contacts, tin-plated posts, board lock, locking ramp, UL94 V-0, -40°C to 105°C, RoHS3.

Molex Micro-Fit 3.0 43045 series, 24-position dual-row header, 3.00mm pitch, male pin, tin-plated brass contacts rated 8A per circuit at 600V. Through-hole kinked-pin solder termination, shrouded 4-wall housing with locking ramp, UL94 V-0 rated LCP insulator, -40 to 105°C operating range.

Molex Micro-Fit 3.0 43045 series, 430450625, 6-position dual-row header, 3.00mm pitch, 8A per circuit, 600V, through-hole, gold mating contacts, tin solder posts, shrouded 4-wall, locking ramp, tray.

Molex Micro-Fit 3.0 43045 header, 430452007, 20 circuits, dual-row, 3.00 mm pitch, right-angle surface mount, board lock, locking ramp, shrouded 4-wall, gold mating contacts 15.0 µin over tin solder tails 100.0 µin, rated 8 A per circuit at 600 V, operating range -40°C to 105°C, UL94 V-0 LCP housing, SMT solder term...

Molex Micro-Fit 3.0 43045, board-to-cable/wire header, 10 positions, 2 rows, 0.118" (3.00mm) pitch, 8A per circuit, 600V, gold mating contact (15.0µin) / tin solder-tail (100.0µin), 4-wall shrouded, locking ramp, through-hole vertical, UL94 V-0, black LCP housing, tray pack.

Molex Micro-Fit 3.0 43045 series header, 4 circuits, dual-row, 3.00mm pitch, 8A at 600V, gold-plated mating contact, tin solder tail, 4-wall shrouded, through-hole, kinked pin, locking ramp, board guide/board lock, UL94 V-0 LCP, black, tray.

Molex Micro-Fit 3.0 43045 header, 18-position dual-row, 0.118" (3.00 mm) pitch, right-angle through-hole, male pin, tin-plated, locking ramp, board lock, 8 A per circuit, 600 V.

Molex Micro-Fit 3.0 43045 header, 10 positions, dual-row 0.118 in (3.00 mm) pitch, surface-mount, gold mating contacts 15.0 µin (0.38 µm) over tin solder tails 100.0 µin (2.54 µm), 8 A per circuit, 600 V, locking ramp, shrouded 4-wall, UL94 V-0, -40°C to 105°C.

Molex Micro-Fit 3.0 43045 series header, 430450414, vertical through-hole, 4 circuits, dual-row, 0.118" (3.00 mm) pitch, male pin, gold mating finish (30.0 µ"), tin solder tail (100.0 µ"), rated 8 A per circuit at 600 V, shrouded 4-wall housing with locking ramp, board guide, UL94 V-0.

Molex Micro-Fit 3.0 43045 series, 430450406 header, 4 circuits, dual-row, 0.118 in (3.00 mm) pitch, right-angle surface mount with board lock, 8 A per circuit at 600 V, tin-plated brass contacts, shrouded 4-wall with locking ramp, black glass-filled LCP housing, UL94 V-0, -40°C to 105°C.

Molex Micro-Fit 3.0 43045 series vertical header, 430450427, 4 circuits, 2 rows, 3.00 mm pitch, 8 A per circuit, 600 V, tin-plated contacts, through-hole solder, shrouded 4-wall with locking ramp.

Molex Micro-Fit 3.0 43045 series 430450214, dual-row 2-position through-hole header, 3.00 mm pitch, 8 A per circuit at 600 V, gold-over-brass mating contacts (30 µin), tin-plated post (100 µin), locking ramp, 4-wall shrouded, board guide, UL94 V-0 LCP housing, -40 to 105 °C, tray.

Molex Micro-Fit 3.0 43045 series 4-position dual-row header, 0.118" (3.00 mm) pitch, shrouded 4-wall, through-hole kinked-pin solder, tin-plated contacts rated 8 A at 600 V, UL94 V-0 black LCP housing.

Molex Micro-Fit 3.0 43045 series, Header, 4 Positions, 2 Rows, 0.118" (3.00mm) Pitch, Through Hole, Solder, Gold Mating Contact, 8A, 600V, Shrouded, Locking Ramp.

Molex Micro-Fit 3.0 430450612, 6-position dual-row through-hole header, 3.00 mm pitch, 8 A per contact, 600 V, tin-plated (mating and post), locking ramp, board guide, UL94 V-0 LCP housing, -40°C to 105°C, tray.

Molex Micro-Fit 3.0 43045 series, 430450400 header, 4 positions, dual-row, 3.00mm pitch, 8A per circuit at 600V, right-angle through-hole, tin-plated brass contacts, board lock, locking ramp, UL94 V-0 black LCP housing, tray.

Molex Micro-Fit 3.0 43045 series shrouded header, 2 positions, 2 rows, 3.00mm row spacing, 8A per circuit, gold mating finish / tin post, through-hole, locking ramp, -40 to 105°C, RoHS3.

Molex Micro-Fit 3.0 43045 header, 2 positions, dual-row, 3.00 mm pitch, right-angle through-hole, 8 A per circuit, 600 V, gold mating / tin solder plating, board lock, locking ramp, UL94 V-0.

Molex Micro-Fit 3.0 43045 430450812, Board to Cable/Wire Header, 8 Positions, 2 Rows, 0.118" (3.00mm) Pitch, Through Hole, Kinked Pin Solder, Tin Contacts, 8A, 600V.

Molex Micro-Fit 3.0 43045 series 430450627, 6-position dual-row header, 0.118" (3.00mm) pitch, shrouded 4-wall, locking ramp, through-hole solder, tin plating, rated 8A per contact at 600V.

Molex Micro-Fit 3.0 43045 series 430451212, Header, 12-circuit dual-row 3.00mm pitch, Through Hole, Tin-plated, 8A, 600V, Shrouded 4-wall with Locking Ramp.

Molex Micro-Fit 3.0 43045 series header, 8 positions, dual-row, 3.00mm pitch, through-hole solder, shrouded 4-wall with locking ramp, gold-plated mating contacts, tin-plated posts, rated 8A per circuit at 600V, UL94 V-0, tray.

Molex Micro-Fit 3.0 43045 series, Header, 4 circuits, dual-row, 3.00mm pitch, SMT right-angle, gold mating contacts, 8A, 600V, -40 to 105°C, shrouded 4-wall, locking ramp, solder retention, ROHS3.

Molex Micro-Fit 3.0 430451013, Header, 10 Positions, 2 Rows, 0.118" (3.00mm) Pitch, Through Hole, Solder, Gold Mating, Tin Post, 8A, 600V, Shrouded, Locking Ramp, Board Guide.

Molex Micro-Fit 3.0 43045 series, 8-position dual-row male header, surface-mount right-angle, 3.00mm pitch, gold mating / tin solder-tail contacts, 8A per circuit, 600V, locking ramp, 4-wall shroud, board lock.

Molex Micro-Fit 3.0 43045 series header, 430450622, 6-circuit dual-row, 3.00mm pitch, right-angle through-hole, shrouded, gold mating contacts, 8A, 600V, board lock, UL94 V-0.

Molex Micro-Fit 3.0 43045 series, 430451227, Board to Cable/Wire header, 12 positions, 2 rows, 0.118" (3.00mm) pitch, 8 A per circuit, 600 V, through-hole, tin-plated contacts, shrouded, locking ramp.

Molex Micro-Fit 3.0 43045 series, 10-position dual-row right-angle male header, 3.00 mm pitch, 8 A per circuit at 600 V, tin-plated contacts (100.0 µin), through-hole solder termination, shrouded 4-wall with board lock, -40 to 105 °C, UL94 V-0.

Molex Micro-Fit 3.0 430450607, 6-circuit dual-row 3.00 mm pitch right-angle SMT header, 8 A per circuit at 600 V, gold-plated mating contacts over tin solder tails, 4-wall shroud with locking ramp and board lock.

Molex Micro-Fit 3.0 43045 series, 430450602, right-angle through-hole header, 6 circuits, 2 rows, 3.00mm pitch, gold-plated mating contacts, tin-plated posts, 8A per circuit, 600V, UL94 V-0, -40 to 105°C, board lock, locking ramp, four-wall shroud.

Molex Micro-Fit 3.0 43045 header, 8 circuits dual-row, 0.118 in (3.00 mm) pitch, 8 A per contact at 600 V, gold-plated mating interface, tin solder-post finish, kinked through-hole pin, locking ramp, UL94 V-0, ROHS3 compliant.

Molex Micro-Fit 3.0 43045 series dual-row right-angle header, 2 positions, 3.00 mm row spacing, 8 A per circuit, 600 V, tin-plated contacts, board lock, through-hole solder, UL94 V-0 LCP housing, -40°C to 105°C, ROHS3 Active.

Molex Micro-Fit 3.0 43045 series, 10-position dual-row right-angle header, 3.00 mm pitch, through-hole solder, gold-plated mating contacts, rated 8 A per circuit at 600 V, 4-wall shrouded with board lock, UL94 V-0, -40°C to 105°C.

Molex Micro-Fit 3.0 43045 series, 16-position dual-row male header, board-to-cable, 0.118in (3.00mm) pitch, through-hole solder, 4-wall shrouded with board guide, locking ramp, 8A per circuit, 600V, tin-plated contacts (60µin mating, tin post), 0.390in insulation height, UL94 V-0 LCP housing, black, tray.

Molex Micro-Fit 3.0 43045 series, 430451213, Board to Cable/Wire Header, 12 positions, 2 rows, 0.118" (3.00mm) pitch, Through Hole, Kinked Pin Solder, Gold mating contacts, 8A, 600V.

Molex Micro-Fit 3.0 43045 series, 16-position, 2-row, right-angle male header, 3.00 mm pitch, 8 A per circuit at 600 V, tin-plated contacts, shrouded 4-wall with board lock and locking ramp, through-hole solder termination, tray packaging.

Molex Micro-Fit 3.0 43045 series, Header, 14 positions, dual row, 3.00 mm pitch, Through Hole, Solder termination, Gold mating contacts, 8 A, 600 V, Black LCP housing, Tray.

Molex Micro-Fit 3.0 43045 series, 430451207 header, 12 circuits, dual row, 0.118" (3.00mm) pitch, surface mount right angle, gold mating contacts, 8A, 600V, shrouded 4-wall with locking ramp and board lock.

Molex Micro-Fit 3.0 43045 series header, 430451008, 10-position dual-row right-angle SMT, 3.00 mm pitch, gold mating contacts, 8 A per circuit at 600 V, shrouded 4-wall with locking ramp, board lock, -40°C to 105°C.

Molex Micro-Fit 3.0 430451400, Header, 14 Positions, 2 Rows, 0.118" (3.00mm) Pitch, Right Angle, Through Hole, Solder, Tin Contacts, 8A, 600V, Board Lock, Shrouded - 4 Wall, UL94 V-0.

Molex Micro-Fit 3.0 43045 series 430452000, right-angle through-hole header, 20 circuits dual-row at 0.118" (3.00mm) pitch, tin-plated brass contacts rated 8A per circuit, 600V, shrouded with locking ramp, board-lock feature, -40°C to 105°C, UL94 V-0, tray.

Molex Micro-Fit 3.0 43045 series, 430452013, Board to Cable/Wire Header, 20 Positions, 2 Rows, 0.118" (3.00mm) Pitch, Solder, Through Hole, Gold Mating Contact Finish, 8A, 600V.

Molex Micro-Fit 3.0 43045 430450407, Board-to-Cable/Wire Header, 4 Positions, 2 Rows, 0.118" (3.00mm) Pitch, Surface Mount, Right Angle, Solder Termination, Gold Mating Contact Finish, 8A, 600V.

Molex Micro-Fit 3.0 43045 header, 430451027, 10 circuits, dual-row, 0.118" (3.00 mm) pitch, through-hole solder, tin-plated brass contacts, 8 A per circuit, 600 V, shrouded 4-wall, locking ramp, -40°C to 105°C, UL94 V-0.

Molex Micro-Fit 3.0 43045 series, board-to-cable dual-row header, 10 circuits, 3.00 mm pitch, 8 A per circuit, 600 V, tin-plated mating and post, shrouded 4-wall with board guide, locking ramp, through-hole vertical with kinked solder pin, UL94 V-0 LCP housing, -40°C to 105°C operating range, Active ROHS3.

Molex Micro-Fit 3.0 43045 series header, order code 430450619, 6 circuits, dual row, 0.118" (3.00 mm) pitch, surface-mount solder termination, gold mating / tin post plating, 8 A per circuit, 600 V, 4-wall shroud with locking ramp, -40°C to 105°C, UL94 V-0, Active.

Molex Micro-Fit 3.0 43045 series right-angle header, 4 positions, 2 rows, 3.00mm pitch, gold mating contacts/tin solder tails, 8 A per circuit, 600 V, through-hole, board lock, UL94 V-0.

Molex Micro-Fit 3.0 43045 SMT header, 16 circuits, dual-row, 3.00mm pitch, gold-plated mating contacts, 8A per circuit, 600V, locking ramp, shrouded - 4 wall, surface mount, Tape & Reel.

Molex Micro-Fit 3.0 43045 series, 430450829, 8-position (2-row) vertical header, 0.118" (3.00mm) pitch, through-hole solder, shrouded 4-wall, locking ramp, gold mating contacts (30µin), 8A per circuit, 600V, UL94 V-0, -40°C to 105°C, tray.

Molex Micro-Fit 3.0 43045 series, 18-circuit dual-row right-angle SMT header, 3.00 mm pitch, 8 A per circuit, gold-plated mating contacts, tin solder tails, board lock, shrouded 4-wall, locking ramp, UL94 V-0 LCP, -40°C to 105°C, 600 V.

Molex Micro-Fit 3.0 43045 series, 8-circuit dual-row surface-mount header, 0.118in (3.00mm) pitch, 8A per circuit at 600V, tin-plated mating and post contacts (60.0µin), shrouded 4-wall housing with locking ramp and board lock, LCP insulator, UL94 V-0.

Molex Micro-Fit 3.0 43045 series header, 430450819, 8-position dual-row, 0.118" (3.00mm) pitch, surface-mount, 8A per circuit, gold mating contacts, locking ramp, shrouded 4-wall, -40 to 105°C.

Molex Micro-Fit 3.0 43045 series, 430450608, 6-position dual-row male pin header, 0.118" (3.00mm) pitch, right-angle surface-mount, gold-plated mating contacts rated 8 A per circuit at 600 V, tin solder-post finish, locking ramp, board-lock feature, insulation height 0.290", UL94 V-0 LCP housing, -40°C to 105°C oper...